nichia sts - da1 - 3944 nichia corporation specifications for white led NTSW757Gt pb built rohs compliant
nichia sts - da1 - 3944 1 specifications (1) absolute maximum ratings item symb ol absolute maximum rating unit forward current i f 120 ma pulse forward current i fp 160 ma allowable reverse current i r 85 ma power dissipation p d 396 mw operating temperature t opr - 40~100 c storage temperature t stg - 40~100 c junction temperature t j 120 c * absolute maximum ratings at t s =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ max unit forward voltage v f i f =65ma 2.92 - v r70 luminous flux v i f =65ma 33.5 - lm r8000 luminous flux v i f =65ma 33.2 - l m r9050 luminous flux v i f =65ma 25.9 - lm chromaticity coordinate x - i f =65ma 0.3447 - - y - i f =65ma 0.3553 - - thermal resistance r js - 17 23 c/w * characteristics at t s =25c. * luminous flux value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point.
nichia sts - da1 - 3944 2 ranks item rank min max unit forward voltage - 2.6 3.3 v luminous flux p12 36.0 42.8 lm p11 30.3 36.0 p10 25.5 30.3 p9 21.4 25.5 color rendering index r70 r a 70 - - r8000 r a 80 - - r 9 0 - - r9050 r a 90 - - r 9 50 - - color ranks the color rank has a chromaticity range within a 3 - step macadam ellipse. rank sm503 rank sm573 rank sm653 center point x 0.3447 0.3287 0.3123 y 0.3553 0.3417 0.3282 minor axis a 0.003555 0.003087 0.002709 major axis b 0.008418 0.007809 0.006561 ellipse rotation angle u uu u uu u uu u u uu uu u u uuu uu
nichia sts - da1 - 3944 3 rank sm6550a rank sm6550b rank sm6550c rank sm6550d rank sm6550e rank sm6550f center point x 0.3123 y 0.3282 minor axis a 0.004515 major axis b 0.010935 ellipse rotation angle s =25c. * forward voltage tolerance: 0.05v * luminous flux tolerance: 5% * color rendering index r a tolerance: 2 * color rendering index r 9 tolerance: 4 * the r 9 value for the above rank shall be greater than 0. * chromaticity coordinate tolerance: 0.003 * leds from the above ranks will be s hipped. the rank combination ratio per shipment will be decided by nichia. definition of the macadam ellipse ranks: luminous flux ranks by color rank, color rendering index rank ranking by luminous flux ranking by color coordinates, color rendering index p9 p10 p11 p12 sm503,sm5050a,sm5050b,sm5050c,sm5050d,sm5050e,sm5050f, sm573,sm5750a,sm5750b,sm5750c,sm5750d,sm5750e,sm5750f, sm653,sm6550a,sm6550b,sm6550c,sm6550d,sm6550e,sm6550f r70,r8000 r9050 6 0 a b a p e r f e c t c i r c l e i s d i v i d e d i n t o 6 0 d e g r e e - s e c t i o n s a n d t h e n t r a n s f o r m e d i n t o t h e m a c a d a m e l l i p s e t h a t i s p r e s e n t e d o n t h e c h r o m a t i c i t y d i a g r a m i n t h i s d o c u m e n t .
nichia sts - da1 - 3944 4 chromaticity diagram 5000k 5700k 6500k 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 y x \?E blackbody locus sm5050c sm5750a sm6550c sm6550f sm6550e sm5050f sm5050a sm503 sm5050e sm5050d sm5750f sm5750e sm5750d sm573 sm6550b sm6550a sm6550d sm653 sm5750b sm5750c sm5050b
nichia sts - da1 - 3944 5 outline dimen sions s t s - d a 7 - 7 1 0 0 a n x s x 7 5 7 g n o . ( g u n i t : m m ) t h i s p r o d u c t c o m p l i e s w i t h r o h s d i r e c t i v e . u ? r o h s ? m * ( g u n i t : m m , t o l e r a n c e : 0 . 2 ) o p r o t e c t i o n d e v i c e k a ? i t e m ` | p a c k a g e m a t e r i a l s ? ? | e n c a p s u l a t i n g r e s i n m a t e r i a l s O | e l e c t r o d e s m a t e r i a l s | w e i g h t d e s c r i p t i o n ` h e a t - r e s i s t a n t p o l y m e r ` ? ? + w s i l i c o n e r e s i n ( w i t h d i f f u s e r a n d p h o s p h o r ) ~ + y a g - p l a t e d c o p p e r a l l o y 0 . 0 1 8 g ( t y p ) t h e d i m e n s i o n ( s ) i n p a r e n t h e s e s a r e f o r r e f e r e n c e p u r p o s e s . * d i m e n s i o n s d o n o t i n c l u d e m o l d f l a s h . * t h e s i d e w i t h t h e l a r g e r d i s t a n c e i s t h e c a t h o d e . e x a m p l e : a > b , t h e n a i s t h e s i d e t h a t h a s t h e c a t h o d e . a > b a ` * c a t h o d e m a r k 3 3 2 . 6 2 . 6 0 . 6 5 1 . 4 2 2 . 2 7 c a t h o d e a n o d e 0 . 4 8 2 . 6 a ( c a t h o d e ) b ( a n o d e )
nichia sts - da1 - 3944 6 soldering ? recommended reflow soldering condition(lead ? recommended hand soldering condition recommended soldering pad pattern recommended metal solder stencil aperture * this led is designed to be reflow soldered on to a pcb. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be p erformed more than twice. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temperature gradually from the peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optic al degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip - outs, encapsulant delamination and deformation, and wire breaks, d ecreasing reliability. * repairing should not be done after the leds have been soldered. when repairing is unavoidable, a double - head soldering iron should be used. it should be confirmed beforehand whether the characteristics of the leds will or w ill not be damaged by repairing. * when soldering, do not apply stress to the led while the led is hot. * when using a pick and place machine, choose an appropriate nozzle for this product. using a pick - and - place nozzle with a smaller diameter than t he size of the led's emitting surface will cause damage to the emitting surface and may also cause the led not to illuminate. 120sec m ax pre - heat 180 to 200 c 260c m ax 10sec m ax 60sec m ax above 220c 1 to 5c per sec ( g u n i t : m m ) 0 . 6 1 . 4 5 0 . 9 5 0 . 6 0 . 8 5 2 . 3 0 . 8 5 0 . 4 2 2 . 3 3 . 1 5 0 . 6 1 . 5 3 0 . 6 9 0 . 6 0 . 5 8 2 . 3 3 . 1 5
nichia sts - da1 - 3944 7 * if the top cover tape is removed right next to where the nozzle picks up the leds, regardless of whether the leds have bee n baked or not, it may cause the led to be picked up incorrectly; it is recommended to remove the top cover tape further from where the nozzle picks up the leds. ensure that there are no issues with the conditions when the nozzle picks up the led s. recommended tape removal position(removing the cover tape further from the pick - and - place nozzle) incorrect tape removal position(removing the cover tape right next to the pick - and - place nozzle) * verify the setting conditions when the leds a re mounted onto a pcb to ensure that the leds are mounted onto the pcb with the correct polarity. if the cathode mark is not able to be easily recognized with a visual inspection, check the back or side of the led to determine the polarity. * the recommended soldering pad pattern is designed for attachment of the led without problems. when precise mounting accuracy is required, such as high - density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * c onsider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * when flux is used, it should be a halogen free flux. ensure that the manufacturing process is not designed in a manner where the flu x will come in contact with the leds. * make sure that there are no issues with the type and amount of solder that is being used. * all of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirme d by a normal visual inspection. when using the product, ensure that there are no issues with the soldering conditions. ? pick-and-place nozzle ??` feed direction of the carrier tape ?`?x tape removal position u??` top cover tape u??` top cover tape ? pick-and-place nozzle ?`?x tape removal position ??` feed direction of the carrier tape
nichia sts - da1 - 3944 8 tape and reel dimensions r e e l s i z e : 5 0 0 0 p c s s t s - d a 7 - 7 0 9 9 1 ` 5 0 0 0 * n x x x 7 5 7 x ` / ` t r a i l e r a n d l e a d e r t o p c o v e r t a p e l e d ? ` 4 0 0 m m ` 1 6 0 m m t r a i l e r 1 6 0 m m m i n ( e m p t y p o c k e t s ) l o a d e d p o c k e t s ` e m b o s s e d c a r r i e r t a p e ` ` f e e d d i r e c t i o n l e a d e r w i t h o u t t o p c o v e r t a p e 4 0 0 m m m i n 1 0 0 m m l e a d e r w i t h t o p c o v e r t a p e 1 0 0 m m m i n ( e m p t y p o c k e t ) t h e t a p e p a c k i n g m e t h o d c o m p l i e s w i t h j i s c 0 8 0 6 ( p a c k a g i n g o f e l e c t r o n i c c o m p o n e n t s o n c o n t i n u o u s t a p e s ) . * j i s c 0 8 0 6 ? ` n o . ( g u n i t : m m ) 6 0 + 1 - 0 ` r e e l f 1 3 0 . 2 f 2 1 0 . 8 l a b e l 2 1 0 . 8 1 3 0 . 2 1 1 . 4 1 9 0 . 3 1 8 0 + 0 - 3 - 0 1 . 5 + 0 . 1 ` t a p e 4 0 . 1 1 . 7 5 0 . 1 4 0 . 1 2 0 . 0 5 3 . 5 0 . 0 5 8 + 0 . 3 - 0 . 1 w h e n t h e t a p e i s r e w o u n d d u e t o w o r k i n t e r r u p t i o n s , n o m o r e t h a n 1 0 n s h o u l d b e a p p l i e d t o t h e e m b o s s e d c a r r i e r t a p e . t h e l e d s m a y s t i c k t o t h e t o p c o v e r t a p e . * g ? I ` ` ? ` ( 1 0 n ) l e d ` ` N 3 . 1 8 0 . 1 0 . 2 0 . 0 5 0 . 8 0 . 1 3 . 1 8 0 . 1 c a t h o d e m a r k - 0 1 + 0 . 2
nichia sts - da1 - 3944 9 packaging - tape & reel n i c h i a l e d s t s - d a 7 - 4 9 8 9 n x x x x x x x l a b e l l a b e l n o . r e e l ` ` s e a l m o i s t u r e - p r o o f b a g ? r o h s n x x x x x x x x x x x l e d * * * * * * * n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n t y p e l o t q t y . y m x x x x - r r r p c s r o h s n x x x x x x x x x x x l e d * * * * * * * r r r p c s t y p e r a n k q t y . n i c h i a c o r p o r a t i o n 4 9 1 o k a , k a m i n a k a , a n a n , t o k u s h i m a , j a p a n r e e l s a r e s h i p p e d w i t h d e s i c c a n t s i n h e a t - s e a l e d m o i s t u r e - p r o o f b a g s . ` ? ` d e s i c c a n t s m o i s t u r e - p r o o f b a g s a r e p a c k e d i n c a r d b o a r d b o x e s w i t h c o r r u g a t e d p a r t i t i o n s . ? K ` ` ? y ? ? * ? \ H y ? B ? y * ? Q H n u ? p ? ? * u s i n g t h e o r i g i n a l p a c k a g e m a t e r i a l o r e q u i v a l e n t i n t r a n s i t i s r e c o m m e n d e d . d o n o t e x p o s e t o w a t e r . t h e b o x i s n o t w a t e r - r e s i s t a n t . d o n o t d r o p o r e x p o s e t h e b o x t o e x t e r n a l f o r c e s a s i t m a y d a m a g e t h e p r o d u c t s . p r o d u c t s s h i p p e d o n t a p e a n d r e e l a r e p a c k e d i n a m o i s t u r e - p r o o f b a g . t h e y a r e s h i p p e d i n c a r d b o a r d b o x e s t o p r o t e c t t h e m f r o m e x t e r n a l f o r c e s d u r i n g t r a n s p o r t a t i o n . * u ? ` ? n o ` y i f n o t p r o v i d e d , i t w i l l n o t b e i n d i c a t e d o n t h e l a b e l . * * * * * * * i s t h e c u s t o m e r p a r t n u m b e r . O * * * * * * * * ? f o r d e t a i l s , s e e " l o t n u m b e r i n g c o d e " i n t h i s d o c u m e n t . * ? t h e l a b e l d o e s n o t h a v e t h e r a n k f i e l d f o r u n - r a n k e d p r o d u c t s . * ?
nichia sts - da1 - 3944 10 lot numbering code lot number is presented by using the following alphanu meric code. ymxxxx - rrr y - year year y 2014 e 2015 f 2016 g 2017 h 2018 i 2019 j m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx - nichia's product number rrr - ranking by color coord inates, ranking by luminous flux, ranking by color rendering index
nichia sts - da1 - 3944 11 derating characteristics ntsx757g ? no. sts-da7-8106 0 30 60 90 120 150 0 20 40 60 80 100 120 derating1 (88, 120) (100, 76.0) 0 30 60 90 120 150 0 20 40 60 80 100 120 derating2 (100, 120) 10 100 1000 1 10 100 duty 120 160 S allowable forward current(ma) ???? ( `? ) - S solder temperature(cathode side) vs allowable forward current ?? - S ambient temperature vs allowable forward current S allowable forward current(ma) S allowable forward current(ma) ???? ( `? ) solder temperature(cathode side)( c) ?? ambient temperature( c) ?`?` duty ratio(%) ?`?` - S duty ratio vs allowable forward current 80 c/w ja r = t a =25 c
nichia sts - da1 - 3944 12 optical characteristics NTSW757G ? no. sts-da7-8090 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t =25 c 65ma i fp = t a =25 c * ??? r70 ???? the graphs above show the characteristics for r70 leds of this product. * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3944 13 optical characteristics NTSW757G ? no. sts-da7-8091 0.0 0.2 0.4 0.6 0.8 1.0 350 400 450 500 550 600 650 700 750 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t =25 c 65ma i fp = t a =25 c * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product. * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3944 14 optical characteristics NTSW757G ? no. sts-da7-8092 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 600 650 700 750 800 spectrum ? relative illuminance(a.u.) 90 80 70 60 50 40 30 20 10 0 - 10 - 20 - 30 - 40 - 50 - 60 - 70 - 80 - 90 directivity1 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 1 0.5 0 0.5 1 a 65ma i f = t =25 c 65ma i fp = t a =25 c * ??? r9050 ???? the graphs above show the characteristics for r9050 leds of this product. * ??? all characteristics shown are for reference only and are not guaranteed.
nichia sts - da1 - 3944 15 forward current characteristics / temperature characteristics NTSW757G ? no. sts-da7-8093 2.0 2.5 3.0 3.5 -60 -40 -20 0 20 40 60 80 100 120 tavf 0.6 0.8 1.0 1.2 1.4 -60 -40 -20 0 20 40 60 80 100 120 taiv 10 100 1000 2.0 2.5 3.0 3.5 vfif 65 160 relative luminous flux(a.u.) ?? - ambient temperature vs relative luminous flux forward current(ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 50 100 150 200 ifiv relative luminous flux(a.u.) - forward current vs relative luminous flux forward current(ma) ?R - forward voltage vs forward current ?? - ?R ambient temperature vs forward voltage ?R forward voltage(v) ?R forward voltage(v) ?? ambient temperature( c) ?? ambient temperature( c) * ??? all characteristics shown are for reference only and are not guaranteed. =25 c t a i fp = 65ma i fp = 65ma t a =25 c
nichia sts - da1 - 3944 16 forward c urrent characteristics / temperature characteristics NTSW757G ? no. sts-da7-8094 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 taxy - 40?c 0?c 25?c 100?c x 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 ifxy 10ma 65ma 160ma x y y 65ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? r70 ???? the graphs above show the characteristics for r70 leds of this product.
nichia sts - da1 - 3944 17 forward current characteristics / temperature characteristics NTSW757G ? no. sts-da7-8095 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 taxy - 40?c 0?c 25?c 100?c x 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 ifxy 10ma 65ma 160ma x y y 65ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? r8000 ???? the graphs above show the characteristics for r8000 leds of this product.
nichia sts - da1 - 3944 18 forward current characteristics / temperature characteristics NTSW757G ? no. sts-da7-8096 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 taxy - 40?c 0?c 25?c 100?c x 0.34 0.35 0.36 0.37 0.38 0.32 0.33 0.34 0.35 0.36 ifxy 10ma 65ma 160ma x y y 65ma i fp = ?? - ? ambient temperature vs chromaticity coordinate - ? forward current vs chromaticity coordinate t a =25 c * ??? all characteristics shown are for reference only and are not guaranteed. * ??? r9050 ???? the graphs above show the characteristics for r9050 leds of this product.
nichia sts - da1 - 3944 19 reliability (1) tests and results test reference standard test con ditions test duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed - 4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed - 4701 303 303a t sld =2455c, 5sec, lead - free solder(sn - 3.0ag - 0.5cu) #2 0/22 temperature cycle jeita ed - 4701 100 105 - 40c(30min)~25c(5min)~ 100c(30min)~25c(5min) 100cycles #1 0/50 moisture resistance (cyclic) jeita ed - 4701 200 203 25c~65c~ - 10c, 90%rh, 24hr per cycle 10cycles #1 0/22 high temperature storage jeita ed - 4701 200 201 t a =100c 1000hours #1 0/22 temperature humidity storage jeita ed - 4701 100 103 t a =60c, rh=90% 1000hours #1 0/22 low temperature storage jeita ed - 4701 200 202 t a = - 40c 1000hours #1 0/22 room temperature operating life condition 1 t a =25c, i f =65ma test board: see notes below 1000hours #1 0/22 room temperature operating life condition 2 t a =25c, i f =120ma test board: see notes below 500hours #1 0/22 high temperature operating life t a =100c, i f =75ma test board: see notes below 1000hours #1 0/22 temperature humidity operating life 60c, rh=90%, i f =65ma test board: see notes below 500hours #1 0/22 low temperature operating life t a = - 40c, i f =65ma test board: see notes below 1000ho urs #1 0/22 vibration jeita ed - 4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/22 electrostatic discharges jeita ed - 4701 300 304 hbm, 2kv, 1.5k, 100pf, 3pulses, alternately positive or negative #1 0/22 board bending 1bend to a deflection of 2 mm for 51sec # 3 0/22 soldering joint shear strength jeita ed - 4702b 002 3 5n, 101sec #1 0/22 notes: 1) test board: fr4 board t hickness=1.6mm, copper layer thickness=0.07mm, r ja 80c/w the board bending is performed using an exclusive test board. 2) measurements are performed after allowing the leds to return to room temperature. (2) failure criteria criteria # it ems conditions failure criteria #1 forward voltage(v f ) i f =65ma >u.s.l.1.1 luminous flux( v ) i f =65ma nichia sts - da1 - 3944 20 cautions (1) storage conditions temperature humidity time storage before opening aluminum bag 30c 90%rh within 1 year from delivery date after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. see ipc/jedec std - 020 for moisture - sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical perfor mance degradation. products are packed in moisture - proof aluminum bags to minimize moisture absorption during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moi sture - proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, preferably the origi nal moisture - proof bags for storage. after the period after opening storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight container when not in use. exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristic s. it is also recommended to return the leds t o the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substances which can affect silver plating, such as halogen. do not use sulfur - containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur. the extremely corroded or contaminated plating of leds might cause an open circuit. silicone rubber is recommended as a material for seals. bear in mind, the us e of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. to prevent water condensation, please avoid large temperature and humidity fluctuations for the storage co nditions. do not store the leds in a dusty environment. do not expose the leds to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended. if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage characteristics of the leds. this product should be operated using forward current. ensure that the product is not subjected to either forward or reverse voltage while it is not in use. in particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the led die. when used in displays that are not used for a long time, the main power supply should be switched off fo r safety. it is recommended to operate the leds at a current greater than 10% of the sorting current to stabilize the led characteris tics. ensure that excessive voltages such as lightning surges are not applied to the leds. for outdoor use, necessary measure s should be taken to prevent water, moisture and salt air damage. ( a ) . . . ( b ) . . .
nichia sts - da1 - 3944 21 (3) handling precautions do not handle the leds with bare hands as it will contaminate the led surface and may affect the optical characteristics: it might cause the led to be defor med and/or the wire to break, which will cause the led not to illuminate. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, chipped, delaminate or deformed, causing wire - b ond breaks and catastrophic failures. dropping the product may cause damage. do not stack assembled pcbs together. failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. it may cause wire to break, leading to catastrophic failures. cri rank r9050 leds in this specification use materials that contain halogen - based compounds; the halogen element found in these materials will not affect the leds when the leds are used under the conditions specified in this specification. the other cri ranks in this specification do not use these materials. due to the variation in the amount of the reflective material (white resin) that is coating the protection device, the area around the protection device may appear to be a black spot; this will not affect the characteristics of the led. do not use the location of the protection device to determine the polarity of the led; use the cathode mark. (4) design consideration pcb warpage after mount ing the products onto a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechanical stress is exerted on the l eds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. volatile organic compounds that have been released from materials present around the leds (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the led lens and/or encapsulating resin. if the leds are being used in a hermetically sealed environment, these volatile compou nds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the led light output and/or cause a color shift. in this case, ventilating the environment may improve the reduction in light output and/or color shift. perform a light - up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the leds are planned to be used in a hermetically sealed environment. (5) electrostatic discharge (esd) the products are sen sitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist stra p, esd footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. for devices/equipment that mount the leds, protection against surge voltages should also be used. if tools or equipment contain insulating materials such as glass or plastic, the following mea sures against electrostatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to check if th e leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltage measurement or a light - up test at low current (1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma
nichia sts - da1 - 3944 22 (6) thermal management proper thermal management is an important when designing products with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. the following equations can be used to calculate the junction temperature of the products. 1) t j =t a +r ja ? w 2) t j =t s +r js ? w *t j =led junction temperature: c t a =ambient temperature: c t s =soldering temperature (cathode side): c r ja =thermal resistance from junction to ambient: c/w r js =thermal resistance from junction to t s measuring point: c/w w=input power(i f v f ): w (7) cleaning the leds should not be cleaned with wate r, benzine, and/or thinner. if required, isopropyl alcohol (ipa) should be used. other solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addi tion, the use of cfcs such as freon is heavily regulated. when dust and/or dirt adheres to the leds, soak a cloth with isopropyl alcohol (ipa), then squeeze it before wiping the led s. ultrasonic cleaning is not recommended since it may have adverse e ffects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advised to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international el ectrical commission (iec) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825 - 1:2007 laser safety standard removed leds from its scope. however, please be adv ised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825 - 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belonging into either the exempt group or ris k group 1. high - power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may gr eatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) others the le ds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. the specifications and appearance of this product may change without notice; nichia does not guarantee the contents of this specification. both the customer and nichia will agree on the official specifications of supplied products before the volume production of a program begins. t s p o i n t
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